IC design work packages and engineering for semiconductor equipment — the chip, and the machine that makes it. One review standard across both.
Mixed-signal silicon that senses, measures and manages power — and the digital blocks around it.
Conditioning, conversion, calibration. Temperature, pressure, flow, optical, magnetic.
Current, voltage, temperature, power. Wide-dynamic-range designs.
Regulation, sequencing, rail supervision. Fault detection and supervision.
Sensor-to-controller interfaces. References and clocking.
Front-end digital, embedded memory. DFT and test insertion.
Floorplan to GDSII. P&R, timing closure, DRC and LVS, sign-off.
Delivered as defined work packages on the customer's flow and node, or as complete designs on mature industrial processes at qualified foundries in Europe and Asia.
For equipment makers and their module suppliers — the second market our team comes from.
Machine control, calibration and data software — qualified to the same standard as the hardware it runs on.
Embedded software, FPGA and control electronics. Equipment subsystems and precision instruments.
Test frameworks and diagnostics. Assembly, test and inspection equipment.
Led by architects and project managers with a background in European equipment programs; delivered from Vietnam under the same review discipline and IP protection as our silicon work.
Any customer can hand us a defined work package. Every package follows the same four steps and the same review standard.
01
A full design from brief to verified netlist, or through to prototype silicon.
02
A sensing front-end, monitoring or interface block, delivered to the customer's integration criteria.
03
Verification, physical design, DFT or test of an existing program. The lowest-risk way to start.
04
Software, embedded, test or diagnostics for equipment and modules — scoped and accepted the same way.