Services

Two markets, one engineering organization.

IC design work packages and engineering for semiconductor equipment — the chip, and the machine that makes it. One review standard across both.


Silicon wafer with dies
01 · IC design

Chips: designed, verified, taped out

Design services: defined work packages on the customer's node and flow — verification, physical design, back-end and DFT, test
Full designs on mature industrial processes
Own silicon platform: sensing, measurement and power-monitoring ICs, developed with lead customers
Semiconductor equipment in operation
02 · Semiconductor equipment

Engineering for the machines

Software, embedded and electronics for equipment makers and their module suppliers
Test frameworks, diagnostics and system automation
Developed under European industrial qualification processes

IC design — what we build

Mixed-signal silicon that senses, measures and manages power — and the digital blocks around it.

Sensor signal chains

Conditioning, conversion, calibration. Temperature, pressure, flow, optical, magnetic.

Measurement and monitoring

Current, voltage, temperature, power. Wide-dynamic-range designs.

Power management

Regulation, sequencing, rail supervision. Fault detection and supervision.

Interface and timing

Sensor-to-controller interfaces. References and clocking.

Digital and memory blocks

Front-end digital, embedded memory. DFT and test insertion.

Physical implementation

Floorplan to GDSII. P&R, timing closure, DRC and LVS, sign-off.

Delivered as defined work packages on the customer's flow and node, or as complete designs on mature industrial processes at qualified foundries in Europe and Asia.


Semiconductor equipment engineering

For equipment makers and their module suppliers — the second market our team comes from.

Equipment and test software

Machine control, calibration and data software — qualified to the same standard as the hardware it runs on.

Embedded and electronics

Embedded software, FPGA and control electronics. Equipment subsystems and precision instruments.

Test, diagnostics, automation

Test frameworks and diagnostics. Assembly, test and inspection equipment.

Led by architects and project managers with a background in European equipment programs; delivered from Vietnam under the same review discipline and IP protection as our silicon work.


Equipment and test software

Four ways to start

How we work →

Any customer can hand us a defined work package. Every package follows the same four steps and the same review standard.

01

A complete chip

A full design from brief to verified netlist, or through to prototype silicon.

02

A chip block

A sensing front-end, monitoring or interface block, delivered to the customer's integration criteria.

03

A design stage

Verification, physical design, DFT or test of an existing program. The lowest-risk way to start.

04

An equipment package

Software, embedded, test or diagnostics for equipment and modules — scoped and accepted the same way.

Define a first work package